Advantages :
Quick exchange of parts dedicated to process: platen, carrier and conditioning head (time required 2min).
Perfect for sharing the machine between various teams.

Usage :
The E460 is designed for polishing and planarization of single wafers with diameters between 2" and 8". The optimal use of E460 is in the field of research and development application as well as small scale production requirements due to the machine's flexibility.

The E460 offers 5 process steps. Each step offers a specific set of parameters. The tool allows manual loading with automatic polishing control. Our standard wafer mounting uses vacuum and back pressure but any king of mounting is possible : wax, templates. Special carrier arrangement can be realized to fit to customers requirements.

The tool is equipped with an automatic conditioning device. Connectors for an easy and fast end point connection are placed on the machine back side.

Operator control panel :
The control board is located over the access-window of the polishing area. From this entry the user has access to the plate, carrier and conditioning device, and can load and unload the wafers.


Process control :
Adjustable process parameters :

Slurry flow rate
Temperature
Head and platen speed and direction
Down force
Back pressure
Time

Alternative head and plate rotation directions
Stock removal phase
Rinsing / cleaning cycle
Sweep range
Manual / automatic mode
Selection between 3 slurries

Control cabinet :
Located on top of the tool as well as on the rear, it has an outlet for exhaust.